STM32F303VCT6主流混合信号ARM MCU开发方案

STM32F303VCT6主流混合信号ARM MCU开发方案,第1张

  The STM32F303xB/STM32F303xC family is based on the high-performance ARM® Cortex®-M4 32-bit RISC core with FPU operaTIng at a frequency of up to 72 MHz, and embedding a floaTIng point unit (FPU), a memory protecTIon unit (MPU) and an embedded trace macrocell (ETM)。 The family incorporates high-speed embedded memories (up to 256 Kbytes of Flash memory, up to 40 Kbytes of SRAM) and an extensive range of enhanced I/Os and peripherals onnected to two APB buses.

  The devices offer up to four fast 12-bit ADCs (5 Msps), seven comparators, four operaTIonal amplifiers, up to two DAC channels, a low-power RTC, up to five general-purpose 16-bit timers, one general-purpose 32-bit timer, and two timers dedicated to motor control. They also feature standard and advanced communication interfaces: up to two I2Cs, up to three SPIs (two SPIs are with multiplexed full-duplex I2Ss), three USARTs, up to two UARTs, CAN and USB. To achieve audio class accuracy, the I2S peripherals can be clocked via an external PLL.

  The STM32F303xB/STM32F303xC family operates in the -40 to +85℃ and -40 to +105℃ temperature ranges from a 2.0 to 3.6 V power supply. A comprehensive set of power-saving mode allows the design of low-power applications.

  The STM32F303xB/STM32F303xC family offers devices in four packages ranging from 48 pins to 100 pins.The set of included peripherals changes with the device chosen.

  STM32F303VCT6主要特性:

  • Core: ARM® Cortex®-M4 32-bit CPU with FPU (72 MHz max), single-cycle multiplication and HW division, 90 DMIPS (from CCM), DSP instruction and MPU (memory protection unit)

  • Operating conditions:

  – VDD, VDDA voltage range: 2.0 V to 3.6 V

  • Memories

  – 128 to 256 Kbytes of Flash memory

  – Up to 40 Kbytes of SRAM, with HW parity check implemented on the first 16 Kbytes.

  – Routine booster: 8 Kbytes of SRAM on instruction and data bus, with HW parity check (CCM)

  • CRC calculation unit

  • Reset and supply management

  – Power-on/Power-down reset (POR/PDR)

  – Programmable voltage detector (PVD)

  – Low-power modes: Sleep, Stop and Standby

  – VBAT supply for RTC and backup registers

  • Clock management

  – 4 to 32 MHz crystal oscillator

  – 32 kHz oscillator for RTC with calibration

  – Internal 8 MHz RC with x 16 PLL option

  – Internal 40 kHz oscillator

  • Up to 87 fast I/Os

  – All mappable on external interrupt vectors

  – Several 5 V-tolerant

  • Interconnect matrix

  • 12-channel DMA controller

  • Four ADCs 0.20 μS (up to 39 channels) with selectable resolution of 12/10/8/6 bits, 0 to 3.6 V conversion range, single ended/differential input, separate analog supply from 2 to 3.6 V

  • Two 12-bit DAC channels with analog supply from 2.4 to 3.6 V

  • Seven fast rail-to-rail analog comparators with analog supply from 2 to 3.6 V

  • Four operational amplifiers that can be used in PGA mode, all terminals accessible with analog supply from 2.4 to 3.6 V

  • Up to 24 capacitive sensing channels supporting touchkey, linear and rotary touch sensors

  • Up to 13 timers

  – One 32-bit timer and two 16-bit timers with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input

  – Two 16-bit 6-channel advanced-control timers, with up to 6 PWM channels, deadtime generation and emergency stop

  – One 16-bit timer with 2 IC/OCs, 1 OCN/PWM, deadtime generation and emergency stop – Two 16-bit timers with IC/OC/OCN/PWM, deadtime generation and emergency stop

  – Two watchdog timers (independent, window)

  – SysTick timer: 24-bit downcounter

  – Two 16-bit basic timers to drive the DAC

  • Calendar RTC with Alarm, periodic wakeup from Stop/Standby

  • Communication interfaces

  – CAN interface (2.0B Active)

  – Two I2C Fast mode plus (1 Mbit/s) with 20 mA current sink, SMBus/PMBus, wakeup from STOP

  – Up to five USART/UARTs (ISO 7816 interface, LIN, IrDA, modem control)

  – Up to three SPIs, two with multiplexed half/full duplex I2S interface, 4 to 16 programmable bit frames

  – USB 2.0 full speed interface

  – Infrared transmitter

  • Serial wire debug, Cortex®-M4 with FPU ETM, JTAG

  • 96-bit unique ID

  

STM32F303VCT6主流混合信号ARM MCU开发方案,第2张

  图1.STM32F303xB/STM32F303xC框图

  

STM32F303VCT6主流混合信号ARM MCU开发方案,第3张

  图2.STM32F303xB/STM32F303xC时钟树

  STM32F303VC MCUDiscovery kitSTM32F3DISCOVERY

  The STM32F3DISCOVERY Discovery kit is a complete demonstration and development platform for STMicroelectronics Arm® Cortex®-M4 core-based STM32F303VCT6 microcontroller. It includes an ST-LINK/V2 (or V2-B) embedded debug tool interface, an ST MEMS gyroscope, an ST MEMS E-compass, LEDs, push-buttons, and a USB Mini-B connector.

  

  图3.Discovery kit STM32F3DISCOVERY外形图

  Discovery kit STM32F3DISCOVERY板主要特性:

  • STM32F303VCT6 Arm®(a)-based microcontroller featuring 256 Kbytes of Flash memory, 48 Kbytes of RAM in an LQFP100 package

  • On-board ST-LINK/V2 for PCB Version A or B or ST-LINK/V2-B for PCB Version C and newer

  • USB ST-LINK functions:

  – Debug port

  – Virtual COM port with ST-LINK/V2-B only

  – Mass storage with ST-LINK/V2-B only

  • Board power supply: through the USB bus or from an external 3 V or 5 V supply voltage

  • External application power supply: 3 V and 5 V

  • L3GD20, ST MEMS motion sensor, 3-axis digital output gyroscope

  • LSM303DLHC, ST MEMS system-in-package featuring a 3D digital linear acceleration sensor and a 3D digital magnetic sensor

  • Ten LEDs:

  – LD1 (red) for 3.3 V power-on.

  – LD2 (red/green) for USB communication.

  – Eight user LEDs, LD3/10 (red), LD4/9 (blue), LD5/8 (orange) and LD6/7 (green)。

  • Two push buttons (user and reset)

  • USB USER with Mini-B connector

  • Extension header for LQFP100 I/Os for quick connection to prototyping board and easy probing

  • Comprehensive free software including a variety of examples, part of STM32CubeF3 package or STSW-STM32118 for legacy Standard Library usage

  

STM32F303VCT6主流混合信号ARM MCU开发方案,第4张

  图4.Discovery kit STM32F3DISCOVERY硬件框图

  

STM32F303VCT6主流混合信号ARM MCU开发方案,第5张

  图5.Discovery kit STM32F3DISCOVERY电路图(1)

  

STM32F303VCT6主流混合信号ARM MCU开发方案,第6张

  图6.Discovery kit STM32F3DISCOVERY电路图(2):ST-LINK/V2(仅SWD)

  

STM32F303VCT6主流混合信号ARM MCU开发方案,第7张

  图7.Discovery kit STM32F3DISCOVERY电路图(3):STM32F303VCT6 MCU

  

STM32F303VCT6主流混合信号ARM MCU开发方案,第8张

  图8.Discovery kit STM32F3DISCOVERY电路图(4):外设

  

STM32F303VCT6主流混合信号ARM MCU开发方案,第9张

  图9.Discovery kit STM32F3DISCOVERY PCB布局图:顶层

  

STM32F303VCT6主流混合信号ARM MCU开发方案,第10张

  图10.Discovery kit STM32F3DISCOVERY PCB布局图:底层

  

STM32F303VCT6主流混合信号ARM MCU开发方案,第11张

  图11.Discovery kit STM32F3DISCOVERY PCB尺寸

  详情请见:

  https://www.st.com/content/ccc/resource/technical/document/user_manual/8a/56/97/63/8d/56/41/73

  /DM00063382.pdf/files/DM00063382.pdf/jcr:content/translations/en.DM00063382.pdf

  en.DM00063382.pdf

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