Microelectronic technology professional graduated from Shanghai Technical Institute of Electronics and Information. After graduation from the University, directly into the XXX of Shanghai, nearly four years of experience in the semiconductor engineer. In YE and PIE, familiar with the process of semiconductor manufacturing process and single process. As YE, my major is tune monitor defecto tool recipe analysis of line defects of abnormal case, eventually find root cause. I am now in the company, engaged in a year of working with PIE, the product is 0.13um memory products, the products are mainly used for bank card and mobile phone SIM card. Which is mainly responsible for the investigation of low yield wafer, to understand some of the process knowledge semiconductor back and some machine where. The PIE of this experience, I and the company's internal customers ( such as CE\/QE\/SALES\/PDE ) and external customers direct dealings. My personality is outgoing, more like dealing with people, so I want to apply for your company's CE position. Because of my university self-study of Japanese, as well as in the company and I often write report in English, but my English may be relatively weak, but now I'm trying to learn English, so I believe I am fit for this position of your company. This is what I want to and you work with reason.
三星,海力士,力晶,华邦,奇梦达。
韩国的三星内存颗粒可能当下最多产能的,标识也比较明显分为两种。一种是直接带有samsung标志,另外一种则是sec英文开头。海力士与前生的现代颗粒合二为一,hynix标志为现代,S K hynix标志为现在的海力士。
力晶,中国台湾内存颗粒生产厂商,其简称为PSC,标志明显。与南亚、茂矽并称台湾内存制造业三巨头。华邦也是台湾著名的内存芯片生产商,内存芯片标志为Winbond。奇梦达是英飞凌科技公司旗下,总部位于德国慕尼黑,德国最大的半导体产品制造商。事后我国的浪潮集团收购。
生产内存颗粒注意事项
通常内存颗粒里面都有无数电路单元,因此很容易产生不良品(Low yield),如果把颗粒打散混杂生产,那么隐患就不可避免了,有些不正规生产商就会选择这样未经过检测程序的半成品晶圆进行封装加工为内存模组,这样生产出来的内存颗粒,品质是毫无保障的。
而品牌内存芯片出厂必须严格经过前工序、后工序和检测工序三个阶段。前工序将高纯度硅晶片切割为晶圆芯片(die),进行简单的EDS测试完成基本功能测试;后工序对晶片做I/O设置和保护;检测工序对芯片所有电性参数进行全面测试,这一工序最重要时间也最长,大约需要将近1000秒。
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