pad是晶圆制造的那一层吗

这里所谓的PAD就是指芯片内部晶圆的标号，.Pad焊垫、园垫

是指零件引脚在板子上的焊接基地.

晶圆（Wafer）是指硅半导体集成电路制作所用的硅芯片，由于其形状为圆形，故称为晶圆。晶圆是生产集成电路所用的载体，一般意义晶圆多指单晶硅圆片

BOAC,是一种焊垫设于有源电路上方焊接的集成电路结构，也叫“有源电路上凸点”。

下面的英文段落供参考。

A BOAC/COA of a semiconductor device is manufactured by forming a conductive pad over a semiconductor device, forming a passivation oxide film over the semiconductor device including the conductive pad, forming an oxide film over the entire surface of the conductive pad and the passivation oxide film, forming an oxide film pattern defining a bond pad region on the conductive pad, sequentially forming a barrier film and a metal seed layer over the oxide film pattern, the passivation oxide film and the conductive pad, forming a metal layer over the metal seed layer, planarizing the metal layer exposing the oxide film pattern and portions of the barrier film and the metal seed layer, and removing the oxide film pattern by an etching process.

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