半导体行业芯片封装与测试的工艺流程

封装测试厂从来料（晶圆）开始，经过前道的晶圆表面贴膜（WTP）→晶圆背面研磨（GRD）→晶圆背面抛光（polish）→晶圆背面贴膜（W－M）→晶圆表面去膜（WDP）→晶圆烘烤（WBK）→晶圆切割（SAW）→切割后清洗（DWC）→晶圆切割后检查（PSI）→紫外线照射（U－V）→晶片粘结（DB）→银胶固化（CRG）→引线键合（WB）→引线键合后检查（PBI）；在经过后道的塑封（MLD）→塑封后固化（PMC）→正印（PTP）→背印（BMK）→切筋（TRM）→电镀（SDP）→电镀后烘烤（APB）→切筋成型（T－F）→终测（FT1）→引脚检查（LSI）→最终目检（FVI）→最终质量控制（FQC）→烘烤去湿（UBK）→包装（P－K）→出货检查（OQC）→入库（W－H）等工序对芯片进行封装和测试，最终出货给客户

chip mounting

[英][tʃip ˈmauntiŋ][美][tʃɪp ˈmaʊntɪŋ]

芯片组装

例句

1that is, the interposer substrate serves as a chip mounting substrate, and the semiconductor chip 103 is provided on the interposer substrate.

即，插入器基底用作芯片安装基底，并且半导体芯片103提供在插入器基底上。

2in particular, the interposer board is used as a chip mounting board, and the semiconductor chip 103 is provided on the interposer board.

具体地，中间板被用作芯片装配板，并且在中间板上提供半导体芯片103。

3The various chip mounting techniques for pressure sensors are compared and discussed in this paper, with showing their advantage and disadvantage as well as the applying conditions.

对压力传感器芯片的各种封装技术作了比较和讨论，指出它们的优缺点和适用场合。还对各种封接键合材料的特性作了概括。

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