英语陪同翻译哪里最好，中国专家翻译网（华译网）？

华译网给我们做过陪同翻译服务，派来的译者翻译水平很高，资历很好，而且价格不高，每天只2000元：

贾先生 电子技术半导体集成电路 石油化工矿产地质英语口语翻译

工作经验

2011 /3--至今：某股份有限公司(500人以上) [ 1 年]

所属行业： 计算机服务(系统、数据服务、维修)

金融保险部 英语翻译

负责某英国保险公司IT项目合作过程中的相关翻译。

1 陪同经理与外方人员进行商务谈判

2 合同、客户需求翻译

3 翻译软件业务系统功能说明文档

4 翻译软件业务系统软件内部资源

5 客户业务系统需求分析

2007 /3--2010 /12：东南某集团(500人以上) [ 3 年9个月]

所属行业： 计算机服务(系统、数据服务、维修)

2005 /10--至今：Global Sources,etc. [ 6 年5个月]

所属行业： 电子技术/半导体/集成电路

杂志社 英语翻译

2005.10　至今　为美国　Global　Sources　杂志社《电子技术专辑》等任兼职翻译,并为其他软件开发商等国际项目进行口译。

2004 /6--2005 /10：某科技有限公司 [ 1 年4个月]

翻译部 本地化英语翻译（英－汉）

2004.6-2005.10　在深圳昆仲科技有限公司任英语本地化翻译，客户主要是　Intel、ABB、Cisco　和　IBM　等国际知名的　IT　公司。对　Trados　6.5,　TM,　TagEditor　及　Multiterm　等的运用及英语本地化的翻译非常熟悉。

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2002 /2--2004 /6：深圳某翻译有限公司 [ 2 年4个月]

所属行业： 生活服务

翻译部 通信英语翻译（汉－英）

2002.2-2004.6在深圳好博译翻译有限公司任通信英语翻译（汉－英），翻译过各类华为、中兴通信及大唐电信的通信技术资料，及其它公司的各类资料（汉－英，英－汉）。并多次到华为去进行保密件翻译。熟练使用TRADOS等翻译软件。

1994 /4--2002 /2：深圳 ABB-MEISHI 电厂 [ 7 年10个月]

所属行业： 生活服务

翻译部 科技翻译

1994.4 - 2002.2 在深圳　ABB-MEISHI　电厂任首席科技英语口笔语翻译，全程参与了该电厂从瑞士ABB引进发电生产线的安装调试、人员培训与技术谈判等各项翻译工作； 在　ABB-MEISHI　电厂期间还全程参加了由深圳　ABB-MEISHI　电厂、 深圳建行和由香港北欧银行牵头的国际银团间的卖方信贷(Supplier's credit)谈判， 担任谈判翻译。

1986 /9--1992 /5：江苏某化工总厂 [ 5 年8个月]

所属行业： 石油/化工/矿产/地质

技术部 科技翻译

1986.9 - 1992.5 在江苏射阳化工总厂从事科技英语翻译工作,独自完成了三个不同厂家四条国外引进生产线的安装调试、人员培训与技术谈判等全部翻译工作（分别为：射阳地毯厂从英国引进的簇绒地毯生产线； 从意大利引进地毯纺丝生产线； 射阳纺织厂从德国引进的气流纺生产线， 以及射阳禽羽加工厂从荷兰引进的鹅鸭屠宰生产线）；

教育经历

2011 /9--至今 上海财经大学 经济与金融 MBA

1982 /9--1986 /7 南京师范大学 英语 本科

海太是封装测试，相对于半导体行业来说属于后道工序，辐射，特气相对于前道对人的危害小一点。如果你是所谓的技术翻译，那是要进洁净室的，也就是车间，这要学到的东西相对多一些，因为你也是要干活的，可以掌握一些半导体后道的技术知识；如果你是行政一类的翻译那就不用进洁净室，相对轻松一点。工资待遇比前道少一点（会比海力士少）。海太是海力士和无锡的国企太极实业合资的半导体封装测试厂。不用在意网上的评价，有人混的好，有人混的查，各人有哥人的看法。我打这么多，分数给我啊，还有不明白的可以再问我

The power semiconductor device and the micro electron

power semiconductor device is in the semiconductor device important link, it and the micro electron component relations is close, because the micro electron component required power semiconductor device forms a complete set provides its power source and the execution system.If develops rapidly computer, when CPU from 286,486, to gallops I, II, III, IV…When development, to took the power source the power semiconductor request increasingly is also harsh.For example the present is developing the voltage to be smaller than 1 volt, on the electric current hundred amperes power sources, this must develop the newest MOSFET component to be able to meet the needs.In order to achieve these renew unceasingly the performance index, the power semiconductor device must use the micro electron component similar fine craft.This will also be this article is detailed narrates.

The power semiconductor device and the integrated circuit close union, in the one has arranged in order four aspects in the chart: Namely

1) power and micro electron component in chip manufacture craft already day by day close: The power MOS component in order to achieve a better performance, for example requests to pass condition the resistance lowly, its craft already from 20 year ago several microns technologies rapidly to submicron even deep submicron development.This and the micro electron component development is consistent.

2) the MOS component seal technology is also approaching to the integrated circuit.These for years, the power MOS component has used has inverted (Flip) likely, ball grid array (BGA) and packing forms and so on multi-chip module (MCM).These all are the quite new integrated circuit packing forms.

3) looked from the component structure that, makes the power MOS component and the integrated circuit in the identical chip perhaps the identical packing, is one of recent development directions.Therefore the power semiconductor device equates simply for established separately the component no longer to be appropriate.Take the IR Corporation product as the example, the power integrated circuit, perhaps and IC does in the same place power component, as well as the special advanced component, held its product one above the half.

4) the comprehensive solution (Total Solution) is each kind of component finally conceives.Seeks the component the function integrity, in the solution application all questions is the component manufacturer's ideal.Had the integrated circuit to enter the power semiconductor device, this kind of comprehensive solution plan was easier to realize.Not only to the low power direction is so, even the high efficiency direction is also pursuing a greater integration rate and the comprehensive solution.Certainly, contains all functions by a component not necessarily forever is the preferred plan.For example must consider the rate of finished products the loss, but also must pay attention to the protection customer to develop the electric circuit on own initiative the enthusiasm.

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