1 Plastic Laminate Substrates
塑胶层压板
2. Flex Substrates
软板
3. Ceramic Packages
陶瓷封装
4. Encapsulation Resins
封装树脂
5. Die Attach Materials
贴片材料
这句话,似应为科技论文里的表述,(推测)特别可能出现于摘要中,故采用不定式、或被动句表述,下任选(被动式,且用一般过去式,推荐)。Microstructure of the silicon chip with damage(s) on the/its(任选) back was observed with TEM(Transmission electron microscope,透射电子显微镜), and back (side) form of thermal oxidated sample(s) was surveyed with metalloscope, thus mechanism of elimination for detrimental impurities (within several well regions on the semiconductor括号里为补充解释,对应中文见下,可不要——译者注) as for damaged (silicon) chips were studied/explored(推荐前者).
1.well region(s),有源区、阱区,如P阱区,P-well region(s),N阱区,N-well region(s)
2.吸杂,去除半导体有源区中有害杂质,亦可简称gettering
3.样品热氧化后背面的形态(有2种理解,后一种见下),还可表述为back (side) form samples after thermal oxidation
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