请问半导体后道工艺中molding是做什么的？

1、半导体后道工艺中“molding”是：注塑成型，就是把一片片已经焊上芯片（DIie Bond），焊上线（Wire Bond）的框架（Leadframe）塑封起来。

2、熔融塑料流动时大分子之间相互摩擦的性质称为塑料的粘性，而把这种粘性大小的系数称为粘度,所以粘度是熔融塑料流动性高低的反映，粘度越大,熔体粘性越强,流动性越差,加工越困难。

3、所有的制品在浇口密封状态下加工是不可能的事。对于一件具体的制品，须进行浇口密封试验并检测浇口密封加工的制品和浇口不密封加工的制品确定那种方式最好。这将可能出现浇口冻结时测试样品100%性能不好，浇口未冻结的制品100%通过检测，或者与之相反。通过简单的观察样品或工艺不能判断是怎么回事。进行浇口密封试验并测试样品才能找到答案。

4、如果浇口不密封对制品的性能有利，那么以所需要时间的一半开始让浇口冷却。由于正常的温度和工艺变化，最坏的可能情况是选择准确的浇口密封时间。然而生产制品时有时候需要让浇口密封，有时候相反，这就会生产前后不一致的产品。

In the automated manufacturing industry, proficient in a variety of brand PLC / touch screen / electronic foot / rotary encoder / servo motor / inverter programming and selection, and familiar with the hydraulic and pneumatic principle, be competent PLC programming and electrical circuit design, etc.工作.

Plastic in the semiconductor industry, proficient in plastic presses (Fujitsu / base-cheng / KAKA brands), ranked machine (robot), plastic mold, and proficient in plastic technologyto other section equipment also gained a better understandingbe competent equipment or technology responsible person / equipment maintenance and management and so on.

In the plastic molding industry, proficient in Haitian injection molding machine, hot welding machine, STAR manipulator, and proficient in injection molding and plastic welding technology.

In the automotive chassis welding industry, familiar with the OTC, AB, MOTOMAN brands, such as welding robot and Germany Eisenmann electrophoretic coating production lines, the establishment of equipment maintenance system is very experience, proficient in the implementation of Total Productive Maintenance TPM. 6sigma familiar with the advanced management concepts.