半导体中BOAC是什么

BOAC,是一种焊垫设于有源电路上方焊接的集成电路结构，也叫“有源电路上凸点”。

下面的英文段落供参考。

A BOAC/COA of a semiconductor device is manufactured by forming a conductive pad over a semiconductor device, forming a passivation oxide film over the semiconductor device including the conductive pad, forming an oxide film over the entire surface of the conductive pad and the passivation oxide film, forming an oxide film pattern defining a bond pad region on the conductive pad, sequentially forming a barrier film and a metal seed layer over the oxide film pattern, the passivation oxide film and the conductive pad, forming a metal layer over the metal seed layer, planarizing the metal layer exposing the oxide film pattern and portions of the barrier film and the metal seed layer, and removing the oxide film pattern by an etching process.

这个课题太大!因为涉及半导体材料的泛范围太广了!简单地说:以半导体材料及衍生材料为主体的各种工艺研发和制造都称为半导体工艺!半导体:顾名思义!就是导电率介于导体和绝缘体之间的金属及非金属材料!常见的硅,锗,都属于此类!

半导体bgbm。

1、BG：是背面减薄(BacksideGridding)，采用In-Feed削磨的方式，将晶圆厚度减薄到目的厚度。提高芯片热扩散效率、电性能、机械性能，减小封装体积，及划片加工量。

2、BM：是背面金属化(BacksideMetallization)，使用电子束产生高温蒸发金属，使金属原子在真空中直线运动，沉积在晶圆上，实现晶圆背面金属化。

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